The positioning and transmission accuracy of the NIDEC SANKYO wafer conveying robot directly determines the transmission accuracy of the entire wafer conveying equipment system. Due to the complex structure of components and strict precision requirements, troubleshooting is also quite difficult.

          Semiconductor robotic arms are mainly suitable for semiconductor front-end processes such as integrated circuits and chip manufacturing, and are used to transport wafers. Robotic arms are commonly used in semiconductor processing steps such as grinding, polishing, etching, diffusion, deposition, assembly, packaging, and testing to transport and position semiconductor chips. In the robotic arm of semiconductor equipment, negative pressure suction is mainly used to pick up chips, that is, the principle of suction cup is used to attach semiconductor chips to quartz or ceramic fingers, and the semiconductor chips are transported through the actions of the robotic arm such as extension, rotation, and lifting.